UV-photoassisted etching of GaN in KOH

Particle precipitation in connection with KOH etching of silicon

Surface Morphology and Formation of Nanostructured Porous GaN by UV-assisted Electrochemical Etching

This article reports on the studies of porous GaN prepared by ultra-violet (UV) assisted electrochemical etching in a solution of 4:1:1 HF: CH3OH:H2O2 under illumination of an UV lamp with 500 W power for 10, 25 and 35 minutes. The optical properties of porous GaN sample were compared to the corresponding as grown GaN. Porosity induced photoluminescence (PL) intensity enhancement was found in t...

Synthesis Porous GaN by Using UV-assisted Electrochemical Etching and Its Optical Studies

The PL of porous GaN sample shows higher intensity with smaller FWHM and red-shifting relative to the as-grown sample. The energy gap for porous GaN sample was smaller compare to the as-grown sample. The SEM surface image of UV-assisted electrochemical etching process is shown a shape and size of pore which was formed on the surface of the GaN, therefore the shape of pores formed was in spheric...

Reactive ion etching of GaN using WI3

Reactive ion etching with SiCl, and BCls of high quality GaN films grown by plasma enhanced molecular beam epitaxy is reported. Factors such as gas chemistry, flow rate, and microwave power affecting the etching rate are discussed. The etch rate has been found to be larger with BCls than with SiC14 plasma. An etch rate of 8.5 &s was obtained with the BCl, plasma for a plasma power of 200 W, pre...

Performance enhancement of InAlN/GaN HEMTs by KOH surface treatment

Superior electronic and thermal properties have made InAlN/GaN high-electron-mobility transistors (HEMTs) an attractive candidate for power electronics applications. However, their high gate leakage current remains a serious challenge affecting the reliability and performance of these heterostructures. Leakage paths through dislocations or by percolation through inhomogeneities in the InAlN all...